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01 — Services

From board
to finished device.

Two fully separate SMT and THT lines, ROHS and Non-ROHS, plus value-added services — from prototype to volume.

Capabilities
TechnologySMT + THT
Min. component0201
PackagesQFP · QFN · BGA · CSP
Speedup to 30,000/h
SolderingROHS + Non-ROHS
Lines2 separate
30 000
components / hour
2
separate lines
50 000
pcs / type per year
0201
min. component
01

Four services

The whole path from sourcing to a delivered, tested device.
01SMD assembly
SMT

SMD assembly

Samsung pick&place places components down to 0201, QFP, QFN, DFN, BGA and fine-pitch CSP. Flexible lines without long downtime.

down to 0201BGA / CSP30k/hROHS + Non-ROHS
02THT — Through-hole
THT

THT — Through-hole

Separate lines for wave soldering of classic through-hole components. Mainly for automotive and industry.

lead-free wave30k/type yrSMT+THT hybrid
03Turn-key service
TURN-KEY

Turn-key service

Turn-key — from board and material procurement, assembly and testing to integration and delivery. Prototypes too.

material sourcingtestingintegrationprototypes
04Value-added services
VALUE-ADD

Value-added services

Burn-In, programming, functional testing and packaging — everything that shortens the path to a finished product.

Burn-In −40/+80°CprogrammingFCTpackaging
ROHS & Non-ROHS
Two lines. No compromise.

Separate paths for leaded and lead-free production protect your assemblies from contamination.

2
separate lines
02

The machines that make it possible

We continuously invest in latest-generation equipment.
SMT pick&place
Samsung-Hanwha SM482+ · 2019
SMT pick&place
Samsung CP-45FV Neo · 2008
Reflow, 7 zones
Heller 1707 MKIII · 2011
Inline stencil printer
EKRA X4SI · 2016
Lead-free wave
ERSA ESV250C · 2012
3D AOI inspection
Parmi Xceed · 2020
03

From inquiry to delivery

A clear, repeatable flow — every step documented.

Inquiry & DFM

Documentation review and manufacturability feedback.

Sourcing

Boards and components — turn-key or to your BOM.

Stencil & paste

EKRA X4SI applies solder paste, SPI control.

SMT placement

Pick&place down to BGA and 0201.

Reflow

Heller 7-zone profile, ROHS or Non-ROHS.

THT & wave

Through-hole and lead-free wave soldering.

3D AOI & test

Optical inspection, burn-in, functional.

Packaging & delivery

Integration, packaging and delivery as agreed.

Two separate lines mean leaded and lead-free production never share the same path — no contamination.
SMD MICRO ELEKTRONIKA
Ready to work together?

Send us your documentation — we'll get back with a quote.

Prototype or volume, turn-key or assembly only. Tell us what you need and we start.

Send inquiry for a quote